Shashank Shakhar Tiwari

1. Installation & commissioning of UV Laser dicing machines for semiconductors dicing. 2. Optical path alignment and standard process development for chip dicing. 3. Testing & calibration for proper functionalities. 4. Development & implementation of PM schedules for UV laser dicing machine. 5. Diagnosing & resolving technical issues related to UV laser dicing machines. 6. Remote & on-site technical support to address customer inquiries.

1. Process development of Thermocompression based wire bonding over RF pads. 2. Critical to quality analysis, and Taguchi method for statistical quality characterization. 3. Nonlinear structural modeling and finite element analysis FEA of the bonding process. 4. Measurement and process evaluation: Electrical tests, physical parameters, and defects.

1. Design and development of testing printed circuit board PCB of MEMS nanodevices. 2. Electrical and optical characterization of MEMS actuator at various stages. 3. Wafer fabrication: layering, lithography, etching, doping, and heat treatment. 3. Multiphysics coupling (solid mechanics and electrostatics) for the piezo transducer. 4. Scientific data analysis, modeling, and documentation. 5. Investigation and analysis of conduction mechanisms within different materials and their junctions.

1. Process development of coil winding, bonding, and testing for electrical machines. 2. Product finite element analysis FEA by coupling Multiphysics (electromagnetic waves EM and heat transfer) and simulation. 3. Trail run support, technicians training at customer site.

• Optimized emissions from Automotive Engine through Catalyst converter utilizing Horiba and AVL Engine emissions testing machines • Gathered reports of tests and analysed data and procedures.

1. Process development of resistance, thermocompression, and adhesive wire bonding. 2. Execute and evaluate the design of experiments DOE and the interpretation of the results. 3. Regular maintenance and safety inspection of wire bonding, and testing equipment. 4. Troubleshoot to reduce the rate of errors, breakages, and substandard productions. 5. Modify high voltage test HVT by introducing vacuum methodology (Paschen’s law). 7. BOM, DMAIC, root cause analysis, repairs cost, spare parts list, etc.

Solid states physics, Optical- electrical characterization of materials, Dielectrics and Ceramics, Incoherent Light Sources, Advanced Physical Chemistry, Modern Crystallographic Methods, Surface Science, Business Simulation, Nanotechnology, Coating technology, Macromolecular & polymer applications.

Strength of materials and solid mechanics, Thermodynamics, heat transfer, HVAC, Fuels, combustion, Internal combustion engine, Machine design (including kinematics and dynamics), Mechatronics and robotics, Drafting, computer-aided design (CAD) & computer-aided manufacturing (CAM).